One-step dual purpose joining technique

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156 71, 156157, 1563797, 219 1041, 219 1053, 219545, 428247, B23K 1300, B29C 2704

Patent

active

043137776

ABSTRACT:
This fastener used in induction heating is a wire screen basically of an eddy-current carrying material such as carbon steel. Selected wires in the screen are copper, sheathed in an insulating material. The screen is placed between two sheets of thermoplastics. When inductively heated, the composite softens and flows around the apertures of the screen. After this heating and joining, the copper wires may be used to conduct electricity.

REFERENCES:
patent: Re26374 (1968-04-01), Beery
patent: 3235712 (1966-02-01), Watson
patent: 3468747 (1969-09-01), Tatnall
patent: 3515849 (1970-06-01), Math
patent: 3520053 (1970-07-01), Hinton et al.
patent: 3574031 (1971-04-01), Heller, Jr. et al.
patent: 4029837 (1977-06-01), Leatherman

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

One-step dual purpose joining technique does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with One-step dual purpose joining technique, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and One-step dual purpose joining technique will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1820127

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.