One step copper damascene CMP process and slurry

Details One step copper damascene CMP process and slurry One step copper damascene CMP process and slurry

2007-10-30

2007-10-30

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S603230, C029S603120, C252S079100, C438S691000, C438S693000

Reexamination Certificate

active

10789777

ABSTRACT:
A Chemical Mechanical Polish (CMP) process and slurry therefore slurry that is capable of removing NiFe, SiO2, Photoresist, Ta, alumina and Cu at substantially the same rate. The slurry is useful for obtaining a substantially planar surface of several materials while avoiding corrosion of Cu coil and NiFe structure.

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