One piece header assembly over molded to an implantable...

Surgery: light – thermal – and electrical application – Light – thermal – and electrical application – Electrical therapeutic systems

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C607S005000, C607S009000, C604S891100

Reexamination Certificate

active

06975906

ABSTRACT:
The present invention is directed to a header assembly attachable to a medical device for the purpose of connecting its output terminals to at least one lead, the lead terminating at a target organ or portion of the body intending to be assisted. A number of leads are connectable to the header, including single and coaxial leads. The header assembly may be molded directly to the medical device or preformed and then attached to the device casing, either by mechanical fastener and/or chemical adhesive.

REFERENCES:
patent: 4010759 (1977-03-01), Boer
patent: 4010760 (1977-03-01), Kraska et al.
patent: 4041956 (1977-08-01), Purdy et al.
patent: 4057068 (1977-11-01), Comben
patent: 4254775 (1981-03-01), Langer
patent: 4262673 (1981-04-01), Kinney et al.
patent: 4471783 (1984-09-01), Buffet
patent: 4764132 (1988-08-01), Stutz, Jr.
patent: 5086773 (1992-02-01), Ware
patent: 5103818 (1992-04-01), Maston et al.
patent: 5282841 (1994-02-01), Szyszkowski
patent: 5336246 (1994-08-01), Dantanarayana
patent: 5549653 (1996-08-01), Stotts et al.
patent: 5643328 (1997-07-01), Cooke et al.
patent: 5741313 (1998-04-01), Davis et al.
patent: 5749911 (1998-05-01), Westlund
patent: 5755743 (1998-05-01), Volz et al.
patent: 5871515 (1999-02-01), Wiklund et al.
patent: 5980973 (1999-11-01), Onyekaba et al.
patent: 6026325 (2000-02-01), Weinberg et al.
patent: 6052623 (2000-04-01), Fenner et al.
patent: 6205358 (2001-03-01), Haeg et al.
patent: 0 006 281 (1980-01-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

One piece header assembly over molded to an implantable... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with One piece header assembly over molded to an implantable..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and One piece header assembly over molded to an implantable... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3475214

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.