One-pack type adhesive composition for dental use

Details One-pack type adhesive composition for dental use One-pack type adhesive composition for dental use

2004-12-08

2009-11-10

McClendon, Sanza L (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

C522S071000, C522S074000, C522S084000, C522S086000, C522S079000, C522S150000, C522S151000, C522S153000, C522S173000, C522S178000, C522S182000, C522S908000, C523S105000, C523S109000, C523S111000, C523S112000, C523S113000, C523S114000, C523S115000, C523S116000, C523S118000, C523S120000, C526S277000, C526S274000, C526S286000, C526S287000, C526S318200, C526S318300, C524S800000, C524S804000, C524S807000, C524S816000, C524S821000, C524S820000, C524S823000, C524S845000

Reexamination Certificate

active

07615582

ABSTRACT:
A hydrophobic acidic group-containing polymeric monomer (a); a water-soluble polymeric monomer (b); water (c); a photopolymerization initiator (d); an aromatic tertiary amine (e) having an electron-withdrawing group; a cross-linkable polymeric monomer (f); and a basic compound (g) for producing a water-soluble salt through a reaction with a part of the hydrophobic acidic group-containing polymeric monomer (a) are included as essential compounding ingredients.A one-part dental adhesive composition that exhibits high adhesive strength and high storage stability in adhesion between a teeth, and more particularly enamel or dentine, and a dental repairing material, and more particularly a resin material, is provided. Since the adhesive composition is one-part type, there is no need to mix in an adhering operation, and in addition, it exhibits high adhesive strength without performing preprocessing (etching processing and priming processing), it is suitably used as a one-step type dental adhesive composition for performing an adhering operation in a teeth repairing treatment in one processing.

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U.S. Appl. No. 11/911,849, filed Oct. 18, 2007, Nakatsuka, et al.

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