One-component hot-setting epoxy resin composition and...

Details One-component hot-setting epoxy resin composition and... One-component hot-setting epoxy resin composition and...

2002-03-29

2008-11-11

Chen, Jack (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S015000, C438S025000, C438S026000, C438S051000, C438S055000, C438S064000, C438S112000, C438S124000, C438S126000, C438S127000

Reexamination Certificate

active

07449362

ABSTRACT:
The present invention provides an one-pack thermosetting type epoxy resin composition which is useful as an underfilling material used when a flip chip or a semiconductor package comprised of a semiconductor element held on a carrier base being mounted onto a wiring substrate; which can omit a fluxing process as adopted for improvement of the bonding force of bumps or solder balls particularly at said mounting and exhibits a good voidless property even at a reflow temperature; and which can be also applied as an adhesive, a paint, a coating material, a sealing material, or the like.The one-pack thermosetting type epoxy resin composition of the present invention comprises as essential ingredients, a liquid epoxy resin and a carboxylic acid having two or more carboxylic groups in molecule as a curing agent.

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