One-component epoxy resin for covering electronic components

Details One-component epoxy resin for covering electronic components One-component epoxy resin for covering electronic components

1998-11-12

2000-11-21

Niland, Patrick D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

522170, 523400, 523427, 524492, 524493, 525396, 525481, 525523, 525524, 528 87, 528103, C08J 300, C08K 334, C08L 6300, C08F28300, C08G 6548

Patent

active

061504351

ABSTRACT:
A one-component epoxy resin for coverage of bare chips and for underfilling of flip chips is disclosed. Two polyol components are combined in the inventive epoxy resin which decidedly improve the properties of the resin with respect to coefficient of expansion, shrinkage stress, substrate adhesion, and reactivity.

REFERENCES:
patent: 5900286 (1999-05-01), Bayer et al.

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