One-chip integrated sensor process

Details One-chip integrated sensor process One-chip integrated sensor process

1995-12-13

1998-02-17

Nguyen, Tuan H.

Fishing, trapping, and vermin destroying

437 51, 437228, 437974, 148DIG135, H01L 2170

Patent

active

057190690

ABSTRACT:
A method for concurrently forming a micromachine element and an integrated circuit device on the same substrate, such that fabrication of the micromachine element and the circuit device requires a minimal number of processing steps. The method is adapted for forming sensing devices, such as accelerometers and pressure sensors, which utilize a small micromachine element, such as a bridge, cantilevered beam, suspended mass, membrane or capacitive element that is supported over a cavity formed in the silicon substrate. Piezoresistors used to detect the deflection of the micromachine element are formed simultaneously with elements of the integrated circuit devices, such that a minimal number of processing steps are required.

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patent: 5145810 (1992-09-01), Matsumi
patent: 5296730 (1994-03-01), Takano et al.
patent: 5320705 (1994-06-01), Fujii et al.
patent: 5326726 (1994-07-01), Tsang et al.
Technische Rundschau, vol. 81, No. 35, Sep. 1, 1989 Bern CH, pp. 100-105, H. A. Kayal et al, "Anwendungsspezifische Intelligente Sensoren--Mechatronik En Miniature".
U.S. Pat. Application SN 08/059,222 to Sparks et al., Filed on May 10, 1993 .

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