On the use of non-spherical carriers for substrate chemi-mechani

Details On the use of non-spherical carriers for substrate chemi-mechani On the use of non-spherical carriers for substrate chemi-mechani

1996-12-23

1998-06-23

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

451285, 451287, 451289, 451388, 451390, B24B 1302

Patent

active

057696926

ABSTRACT:
A substrate holder assembly for immobilizing an integrated circuit (IC) wafer during polishing is described. The substrate holder includes a base plate sized to support the integrated circuit (IC) wafer, a circumferential restraint member arranged with respect to the base plate to engage the IC wafer's edges and a carrier assembly disposed above the base plate and below the IC wafer. The carrier assembly includes a film having a surface that is characterized by a substantially oblate spheroid or hyperboloid surface of rotation, wherein the surface of the film is capable of supporting the IC wafer in a manner causing the IC wafer to bow according to the surface of rotation.

REFERENCES:
patent: 4530139 (1985-07-01), Miller
patent: 4603466 (1986-08-01), Morley
patent: 5423716 (1995-06-01), Strasbaugh
patent: 5441444 (1995-08-01), Nakajima et al.
patent: 5651724 (1997-07-01), Kimura et al.

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