On-line inspection method and system for bonds made to electroni

Details On-line inspection method and system for bonds made to electroni On-line inspection method and system for bonds made to electroni

1982-12-02

1984-04-10

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29584, 228179, H01L 4900

Patent

active

044412487

ABSTRACT:
On-line inspection of electric characteristics of a semiconductor device can be achieved during a step of bonding a lead wire to a chip surface of the semiconductor device in the process of fabricating an electronic component, by the use of a circuit arrangement formed between a lead wire fed from a bonder and connectors serving as electric terminals when the chip is mounted thereon to be made into an electronic component, and by the application of electric power thereto.

REFERENCES:
patent: 3274667 (1966-09-01), Siebertz
patent: 3634930 (1972-01-01), Cranston
patent: 4263547 (1981-04-01), Johnson

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