On die thermal sensor

Data processing: measuring – calibrating – or testing – Measurement system in a specific environment – Electrical signal parameter measurement system

Reexamination Certificate

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Details

C702S099000, C702S130000, C327S512000, C327S539000

Reexamination Certificate

active

07606674

ABSTRACT:
An on die thermal sensor includes a bandgap unit for generating a first voltage containing temperature information, a tracking unit for tracking a voltage level of the first voltage, and a low power control unit for generating a tracking enable signal for enabling the tracking unit and disabling the tracking unit after a minimum tracking operation time of the tracking unit elapses.

REFERENCES:
patent: 6531911 (2003-03-01), Hsu et al.
patent: 6876250 (2005-04-01), Hsu et al.
patent: 7138823 (2006-11-01), Janzen et al.
patent: 2006/0111865 (2006-05-01), Choi
patent: 2006/0158214 (2006-07-01), Janzen et al.
patent: 2007/0040574 (2007-02-01), Janzen et al.
patent: 2007/0098041 (2007-05-01), Seo
patent: 10-255467 (1998-09-01), None
patent: 10-2004-0080357 (2004-09-01), None
patent: 10-2005-0114938 (2005-12-01), None
patent: 10-2006-0042703 (2006-05-01), None
Korean Office Action, issued in Korean Patent Application No. 10-2006-0106113, dated on Feb. 1, 2008.

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