On-clip high frequency reliability and failure test structures

Details On-clip high frequency reliability and failure test structures On-clip high frequency reliability and failure test structures

1996-01-16

1997-04-29

Nguyen, Vinh P.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324 731, 324763, G01R 1512

Patent

active

056252889

ABSTRACT:
Self-stressing test structures for realistic high frequency reliability characterizations. An on-chip high frequency oscillator, controlled by DC signals from off-chip, provides a range of high frequency pulses to test structures. The test structures provide information with regard to a variety of reliability failure mechanisms, including hot-carriers, electromigration, and oxide breakdown. The system is normally integrated at the wafer level to predict the failure mechanisms of the production integrated circuits on the same wafer.

REFERENCES:
patent: 4483629 (1984-11-01), Schwarz et al.
patent: 4739258 (1988-04-01), Schwarz
patent: 4918385 (1990-04-01), Shreeve
patent: 5057441 (1991-10-01), Gutt et al.
patent: 5099196 (1992-03-01), Longwell et al.
patent: 5202626 (1993-04-01), Pham et al.
patent: 5233161 (1993-08-01), Farwell et al.
patent: 5294882 (1994-03-01), Tanaka
patent: 5381087 (1995-01-01), Hirano

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