Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – Groove
Reexamination Certificate
2007-08-14
2007-08-14
Dickey, Thomas L. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Physical configuration of semiconductor
Groove
C257S620000
Reexamination Certificate
active
11161304
ABSTRACT:
A semiconductor chip includes an active inner circuit; a die seal ring surrounding the active inner circuit; a first circuit structure fabricated at a first corner of the semiconductor chip outside the die seal ring and electrically connected to the die seal, wherein the first circuit structure has a first solder pad; and a second circuit structure fabricated at a second corner of the semiconductor chip outside the die seal ring and electrically connected to the die seal, wherein the second circuit structure has a second solder pad.
REFERENCES:
patent: 6365958 (2002-04-01), Ibnabdeljalil et al.
patent: 2003/0218254 (2003-11-01), Kurimoto et al.
patent: 2005/0184362 (2005-08-01), Fujita
Jao Jui-Meng
Kuo Chien-Li
Dickey Thomas L.
Hsu Winston
United Microelectronics Corp.
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