On-chip test circuit for assessing chip integrity

Details On-chip test circuit for assessing chip integrity On-chip test circuit for assessing chip integrity

2007-08-14

2007-08-14

Dickey, Thomas L. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

Groove

C257S620000

Reexamination Certificate

active

11161304

ABSTRACT:
A semiconductor chip includes an active inner circuit; a die seal ring surrounding the active inner circuit; a first circuit structure fabricated at a first corner of the semiconductor chip outside the die seal ring and electrically connected to the die seal, wherein the first circuit structure has a first solder pad; and a second circuit structure fabricated at a second corner of the semiconductor chip outside the die seal ring and electrically connected to the die seal, wherein the second circuit structure has a second solder pad.

REFERENCES:
patent: 6365958 (2002-04-01), Ibnabdeljalil et al.
patent: 2003/0218254 (2003-11-01), Kurimoto et al.
patent: 2005/0184362 (2005-08-01), Fujita

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