On-chip Peltier cooling devices on a micromachined membrane stru

Details On-chip Peltier cooling devices on a micromachined membrane stru On-chip Peltier cooling devices on a micromachined membrane stru

1996-06-27

1998-02-03

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Temperature

257930, 257468, 257419, H01L 2716, H01L 3528

Patent

active

057147914

ABSTRACT:
This invention provides a Peltier cooling device generally useful in cooling electronic devices, especially those which are formed of high Tc superconducting materials. The Peltier device of the invention is formed on a micromachined membrane structure to assure good thermal isolation and to intimately integrate the cooling device with the electronic device it is to cool.
The membrane is formed by selective, controlled etching of a bulk substrate of a material such as silicon. The Peltier device is formed by selectively implanting or depositing appropriate dopants to form n-doped and p-doped segments on the membrane with a junction between the differently doped segments at the approximate mid-point of the membrane.

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R. Smythe, Electronic Products, Aug. 1995, entitled "Thermoelectric coolers take the heat out of today's hot chips", pp. 47-48.

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