Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2008-07-01
2008-07-01
Nguyen, Ha (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S765010, C438S014000, C714S758000
Reexamination Certificate
active
07394273
ABSTRACT:
A packaged semiconductor chip is provided which includes a semiconductor chip and a package element. The semiconductor chip includes a plurality of semiconductor devices and a plurality of conductive features disposed at an exterior face of the semiconductor chip. The package element has a plurality of external features conductively connected to the plurality of conductive features of the semiconductor chip. The semiconductor chip includes a monitored element including a conductive interconnect that conductively interconnects a first node of the semiconductor chip to a second node of the semiconductor chip. A detection circuit in the semiconductor chip is operable to compare a variable voltage drop across the monitored element with a reference voltage drop across a reference element on the chip at a plurality of different times during a lifetime of the packaged semiconductor chip so as to detect when the resistance of the monitored element is over threshold.
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Cranford, Jr. Hayden C.
Gluschenkov Oleg
Hsu Louis L.
Mason James S.
Sorna Michael A.
International Business Machines - Corporation
Neff Daryl K.
Nguyen Ha
Schnurmann H. Daniel
Vazquez Arleen M
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