Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Reexamination Certificate
2005-05-17
2005-05-17
Flanigan, Allen J. (Department: 3753)
Heat exchange
Intermediate fluent heat exchange material receiving and...
Liquid fluent heat exchange material
C165S121000
Reexamination Certificate
active
06892800
ABSTRACT:
The invention provides a structural principle wherein a combination fan-heatsink type cooling device transfers a large amount of heat into an ambient while producing minimal acoustic noise. The fan-heatsink has top and bottom cover members with a central power shaft between them, the shaft has fins that rotate around the shaft between the covers to move ambient. The ambient enters the fan-heatsink through inlets through the covers near the central power shaft and is forced out through louvers that make up the peripheral of the fan-heatsink housing. The fan-heatsink cooling device is positioned so that heat radiating from the heat source such as a chip enters the housing through the inlets near the central shaft and heat pipes are arranged to carry heat from the chip source to and through the louvers so that the ambient forced through the louvers absorbs heat transferred to the louvers at the place where it is immediately carried out of the fan-heatsink structure.
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patent: 20020093255 (2002-07-01), Matsumoto
Beck Thomas A.
Flanigan Allen J.
International Business Machines - Corporation
Morris Daniel P.
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