Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-03-28
2010-02-16
Garber, Charles D (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C427S555000, C427S064000, C427S068000, C427S556000, C427S010000, C438S099000, C438S478000, C257S797000
Reexamination Certificate
active
07662663
ABSTRACT:
A method of patterning a substrate according to several steps, including: a) mechanically locating a first masking film over the substrate; and b) segmenting the first masking film into a first masking portion and one or more first opening portions in first locations. Next, mechanically locate a first removal film over the first masking portion and first opening portions. Afterwards, one or more of the first opening portions are adhered to the first removal film. The first removal film and one or more of the first opening portions adhered to the first removal film are mechanically removed to form one or more first openings in the first masking film. Finally, materials are deposited over the substrate through the first openings in the first masking film.
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Cok Ronald S.
Rider Christopher B.
Eastman Kodak Company
Garber Charles D
Owens Raymond L.
Sene Pape
Shaw Stephen H.
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