Plastic and nonmetallic article shaping or treating: processes – Encapsulating normally liquid material
Reexamination Certificate
2007-03-20
2007-03-20
Seidleck, James J. (Department: 1711)
Plastic and nonmetallic article shaping or treating: processes
Encapsulating normally liquid material
C427S213300, C427S213310, C427S213330, C428S402000, C428S402200, C424S489000, C424S401000, C424S059000, C424S070100
Reexamination Certificate
active
11003234
ABSTRACT:
The present invention relates to a hollow sphere polymer composition suitable for absorbing active ingredients including oily substances and hydrophobic materials. A process for encapsulating one or more active ingredients using hollow sphere polymers is described.
REFERENCES:
patent: 4171228 (1979-10-01), Lowrey
patent: 4303679 (1981-12-01), Raccach
patent: 4663068 (1987-05-01), Hagemann et al.
patent: 5036109 (1991-07-01), Chip et al.
patent: 5102693 (1992-04-01), Motosugi et al.
patent: 5137864 (1992-08-01), Yaguchi et al.
patent: 5145675 (1992-09-01), Katz et al.
patent: 5157084 (1992-10-01), Lee et al.
patent: 5216044 (1993-06-01), Hoshino et al.
patent: 6384104 (2002-05-01), Chang et al.
patent: 2004/0121003 (2004-06-01), Chichering et al.
patent: 2005/0043458 (2005-02-01), Adamo et al.
patent: 0467646 (1992-01-01), None
patent: 0545556 (1993-06-01), None
patent: 1111034 (2001-06-01), None
patent: 1027147 (2002-05-01), None
patent: WO9220742 (1992-11-01), None
patent: WO9730109 (1997-08-01), None
Encyclopedia of Polymer Science and Technology: Microencapsulation, 2005 John Wiley & Sons, Inc. All rights reserved pp. 1 and 25.
Haider Saira B.
Rohm and Haas Company
Seidleck James J.
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