Ohmic contacts to thin film circuits

Details Ohmic contacts to thin film circuits Ohmic contacts to thin film circuits

1975-11-04

1977-05-24

Mack, John H.

Chemistry: electrical and wave energy

Processes and products

29621, 204192F, 204298, 427103, 338309, 338327, C25D 500, C23C 1500, H01H 3736

Patent

active

040254046

ABSTRACT:
A process for establishing gold contact studs on thin film circuits consists in localized sublayer deposition of a platinum-gold alloy followed by subsequent electrolytic gold thickening of the studs. The studs so produced are particularly fit for thermocompression interconnection.

REFERENCES:
patent: 3370262 (1968-02-01), Marty et al.
patent: 3616406 (1971-10-01), Turner
patent: 3793175 (1974-02-01), Joly et al.
patent: 3864180 (1975-02-01), Barraclough
patent: 3907620 (1975-09-01), Abraham et al.
patent: 3921200 (1975-11-01), Pille
S. S. Lau, "The Use of Sputtered Conductor Materials in Film Integrated Circuits, " Thin Solid Films, vol. 14, pp. 87-103 (1972).
W. D. Westwood et al., "Tantalum Thin Films, " Academic Press, 1975, pp. 282-288.

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