Ohmic contacts for hydrogenated amorphous silicon

Coating processes – Electrical product produced – Condenser or capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427 74, 427 87, 427 88, 427 93, H01L 21324

Patent

active

045296197

ABSTRACT:
A method of forming an ohmic contact between an amorphous silicon hydride semiconductor and a substrate which includes coating a film of palladium on the substrate and overcoating the palladium with a thin film of amorphous silicon hydride forming a thin palladium silicide layer. The amorphous silicon hydride is dehydrogenated by annealing forming a highly defective amorphous silicon layer and a thicker palladium silicide layer through which carriers can readily tunnel. The amorphous silicon hydride semiconductor is then coated over the amorphous silicon layer to the desired thickness.

REFERENCES:
patent: 3927225 (1975-12-01), Cordes et al.
patent: 3965279 (1976-06-01), Levinstein et al.
patent: 3968272 (1976-07-01), Anand
patent: 4180596 (1979-12-01), Crowder et al.
patent: 4322453 (1982-03-01), Miller
patent: 4407710 (1983-10-01), Moustakas
patent: 4446168 (1984-05-01), Kato
Matysik et al., "Hydrogen Evolution from Plasma-Deposited Amorphous Silicon Films", J. Vac. Sci. Technol. 15(2), Mar./Apr. 1978, pp. 302-304.
IBM Technical Disclosure Bulletin, vol. 19, No. 9, Feb. 1977, "Contact Barrier Metallurgy for Mosfet Gate", P. L. Garbarino et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Ohmic contacts for hydrogenated amorphous silicon does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ohmic contacts for hydrogenated amorphous silicon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ohmic contacts for hydrogenated amorphous silicon will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1735715

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.