Ohmic contact to p-type InP

Coating processes – Electrical product produced – Condenser or capacitor

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427125, 357 67, 357 71, 29569L, H01L 2128, B05D 512

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active

043661866

ABSTRACT:
An ohmic contact to a semiconductor device comprising p-type InP is formed by sequentially depositing beryllium-gold and gold layers on InP and then heat-treating the device at a temperature less than 440 degrees C. An ohmic contact to p-type InGaAsP can be similarly formed.

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patent: 3850688 (1974-11-01), Halt
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patent: 4022931 (1977-05-01), Black et al.
patent: 4218271 (1980-08-01), Wood
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patent: 4260429 (1981-04-01), Moyer
Bergh et al., Light-Emitting Diodes, Clarendon Press, Oxford, 1976, pp. 441, 456.
Schumaker et al., "Dicing Induced Damage in GaP Electroluminescent Diodes", Journal of the Electrochemical Society, vol. 119, No. 9, Sep. 1972, p. 1233.
Schiavone et al., "Ohmic Contacts for Moderately Resistive p-Type InP", Journal of Applied Physics, vol. 46, No. 1, Jan. 1975, pp. 452-453.
Ho et al., "Stable Junctions Between GaAs Semiconductors and Metal Contacts Using a Metallic Compounds as a diffusion Barrier", IBM Tech. Disclosure Bulletin, vol. 21, No. 4, Sep. 1978, p. 1752.

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