Off-grid decoupling of ball grid array (BGA) devices and method

Details Off-grid decoupling of ball grid array (BGA) devices and method Off-grid decoupling of ball grid array (BGA) devices and method

2008-01-29

2008-01-29

Wilczewski, Mary (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S738000, C257SE23060, C716S030000, C716S030000

Reexamination Certificate

active

07323787

ABSTRACT:
A multilayered printed wiring board having a ball grid array (BGA) land pattern in which each land in the pattern is connected to a respective via by a link connector, a method of adapting spacing between selected adjacent via and respective link pairs to receive decoupling capacitor pads, comprising rotating, elongating and/or truncating the selected adjacent pairs and rotating their respective corresponding via pairs to adapt the spacing between the selected adjacent via pairs in the BGA land pattern and applying the capacitor pads to the selected via pairs. The selected adjacent via pairs and their respective link connectors are rotated, elongated and/or truncated in mutually opposite directions.

REFERENCES:
patent: 2006/0110848 (2006-05-01), Brown

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