Off-chip LC circuit for lowest ground and VDD impedance for...

Wave transmission lines and networks – Coupling networks – Nonreciprocal gyromagnetic type

Reexamination Certificate

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C330S302000, C330S305000

Reexamination Certificate

active

07321273

ABSTRACT:
Off-chip LC circuit for lowest ground and VDD impedance for power amplifier. A novel approach is made by which a chip to PCB (Printer Circuit Board) interface may be made such that the ground and VDD potential levels are effectively brought onto the die of the chip such that a true ground potential is maintained within the chip. This off-chip LC circuit operates cooperatively with an on-chip decoupling capacitor to reduce the overall effective inductance of the bond wires employed to bring signal and voltage levels from the die to the chip exterior. This circuit ensures a relatively low impedance for a PA (Power Amplifier) that is implemented within chip thereby providing for improved performance.

REFERENCES:
patent: 4864250 (1989-09-01), Bacon
patent: 5945878 (1999-08-01), Westwick et al.
patent: 6538515 (2003-03-01), Brandt
patent: 6636119 (2003-10-01), Vathulya
patent: 7119631 (2006-10-01), Castaneda et al.
patent: 7193477 (2007-03-01), Chang et al.

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