Off-center solder ball attach assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

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Details

C257S737000, C257S779000, C257S786000

Reexamination Certificate

active

06870267

ABSTRACT:
A connection component includes a dielectric element having a first surface and a second surface, and conductive pads on the first surface of the dielectric element, each conductive pad having a center. The connection component also includes conductive vias electrically connected to the conductive pads and extending toward the second surface of the dielectric element, each of the vias having an opening at one of the conductive pads. At least one of the via openings is offset from the center of at least one of the conductive pads.

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