Off-center grooved polish pad for CMP

Details Off-center grooved polish pad for CMP Off-center grooved polish pad for CMP

1997-03-10

1998-12-01

Eley, Timothy V.

Abrading

Abrading process

Glass or stone abrading

451 57, 451285, B24B 100

Patent

active

058429107

ABSTRACT:
A method and apparatus for polishing a semiconductor wafer using a polishing pad. The polishing pad contains circumferential grooves which are located off center from the geometric center of the polishing pad.

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patent: 5534106 (1996-07-01), Cote et al.
patent: 5558563 (1996-09-01), Cote et al.
patent: 5605490 (1997-02-01), Laffey et al.

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