Oblong peripheral solder ball pads on a printed circuit...

Details Oblong peripheral solder ball pads on a printed circuit... Oblong peripheral solder ball pads on a printed circuit...

2011-03-15

2011-03-15

Wilczewski, Mary (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S678000, C257S728000, C257S778000, C257S787000, C257SE23037, C257SE23043

Reexamination Certificate

active

07906835

ABSTRACT:
Methods, systems, and apparatuses for ball grid array land patterns are provided. A ball grid array land pattern includes a plurality of land pads and electrically conductive traces. The plurality of land pads is arranged in an array of rows and columns. A perimeter edge of the array includes a pair of adjacent oblong shaped land pads. An electrically conductive trace is routed between the pair of adjacent oblong shaped land pads from a land pad positioned in an interior of the array to a location external to the array. The oblong shaped land pads are narrower than standard round land pads, and thus provide more clearance for the routing of traces. The oblong shaped land pads enable more land pads of the land pattern array to be routed external to the array on each routing layer, and thus can save printed circuit board component and assembly costs.

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European Search Report from application No. 08014165.8, dated Mar. 18, 2010, 3 pages.

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