Object cutting method

Details Object cutting method Object cutting method

2011-08-09

2011-08-09

Chen, Jack (Department: 2893)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S463000, C438S464000, C257SE21238

Reexamination Certificate

active

07994024

ABSTRACT:
An object cutting method which can reliably remove particles remaining on cut sections of chips is provided. An expandable tape23is electrically charged in a state where a plurality of semiconductor chips25obtained by cutting a planar object to be processed along a line to cut are separated from each other on the expandable tape23.This electric action causes particles remaining on cut sections of the semiconductor chips25to eject therefrom even when a molten processed region is formed in the cut sections. Therefore, particles remaining on the cut sections of the chips25can reliably be removed.

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