Object and audio medium arrangement and formation process

Special receptacle or package – Combined or convertible – Packaged assemblage or kit

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

206232, 206310, 2063081, 431253, B65D 6900

Patent

active

061128910

ABSTRACT:
An audio medium and candle arrangement includes a candle having an outer contour and a first end and a second end. An audio medium is provided having an outer contour which generally corresponds to the outer contour of the candle. The audio medium is positioned adjacent to the candle. The candle enclosure maintains a position of the audio medium relative to the candle. The enclosure may be a tin enclosure with a bottom tin (canister) portion having a candle provided therein and a tin lid for closure of the tin. The tin lid is provided with an inner diameter which is slightly larger than the outer diameter of a compact disc. The inner diameter of the tin lid is provided in a normal way for mating with the tin bottom to close the tin. A compact disc is provided on a compact disc backer or audio medium support, such as a support made of cardboard. Preferably the cardboard backer has a CD center support element for positioning and supporting the CD relative to the backer. The backer and the CD are preferably shrink wrapped together to form a shrink wrap subassembly. The shrink wrap subassembly is positioned in the underside of the tin lid. By selecting a diameter of the backer which is just slightly larger than the inside diameter of the tin lid, it is possible to firmly position the CD allowing the lid to be closed while retaining the shrink wrap subassembly in a position relative to the tin lid.

REFERENCES:
patent: 5076433 (1991-12-01), Howes
patent: 5542532 (1996-08-01), Mitchell
patent: 5748608 (1998-05-01), Spector
patent: 5893453 (1999-04-01), Ishikawa

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Object and audio medium arrangement and formation process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Object and audio medium arrangement and formation process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Object and audio medium arrangement and formation process will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2202797

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.