O-ring package

Details O-ring package O-ring package

1991-02-28

1993-02-09

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Portion of housing of specific materials

257789, 257666, H01L 2304, H01L 2310

Patent

active

051856530

ABSTRACT:
A transfer molded plastic package having a cavity for accommodating a semiconductor chip is disclosed. A leadframe assembly process is shown wherein the leadframe finger pattern is provided with a resilient or elastic O-ring bead. Top and bottom housing plates which have dimensions that are larger than the bead form the upper and lower surfaces of the package. These plates can be formed of any suitably rigid material. They may be composed of ceramic in low power devices. For high power operation at least one metal plate can be employed. The chip or chips are connected to the lead frame and, along with the top and bottom plates, is located in a transfer mold. The plates are in registy and located so that their outer edges extend beyond the O-ring bead. The mold cavities include faces which press against the plates which are held apart by the O-ring bead so that the bead is compressed by the mold closure. A plastic encapsulant is molded around the periphery of the plates so that the leadframe fingers are secured therein to become package pins.

REFERENCES:
patent: 3714370 (1970-01-01), Nixen et al.
patent: 4629824 (1986-12-01), Gilder et al.
patent: 4859632 (1989-08-01), Lumbard
patent: 4899207 (1990-02-01), Hallowell et al.

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