Nucleate boiling surface for increasing the heat transfer from a

Heat exchange – With valve or movable deflector for heat exchange fluid flow – With by-pass of heat exchanger or heat exchanger section

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165 80C, 174 16HS, 357 81, H01L 2504, H01L 2302

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active

043120121

ABSTRACT:
The invention is a structure for improving the cooling characteristics of a silicon semiconductor device immersed in a fluid coolant. The cooling improvement is achieved by enhancing the nucleate boiling characteristics of the silicon device by initially forming lattice defects on the backside surface of the device by sandblasting and subsequently etching the damaged surface to remove the lattice defects and thereby produce an intricate surface morphology which provides nucleate boiling sites.

REFERENCES:
patent: 3741292 (1973-06-01), Akalu et al.
patent: 4050507 (1977-09-01), Chu et al.
patent: 4053942 (1977-10-01), Dougherty et al.
patent: 4156458 (1979-05-01), Chu et al.
IBM Technical Disclosure Bulletin; vol. 19, No. 8, Jan. 1977; pp. 3125-3126.

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