Nozzle structure for soldering and desoldering

Details Nozzle structure for soldering and desoldering Nozzle structure for soldering and desoldering

1987-07-27

1988-11-29

Godici, Nicholas P.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 20, 228 447, 228264, 219373, 222566, B23K 304, B23K 3704

Patent

active

047875488

ABSTRACT:
A nozzle device is adjustably positionable over a component which is disposed on a substrate, for registering relatively precisely against the component relative to the substrate for delivering a flow of uniformly heated air. The heated air is directed to the sides of the component to melt solder associated with terminals thereon. A series of changeable nozzles can be used for various component and terminal configurations and can be moved into or out of registry with the component. A vacuum apparatus can be provided for contacting the component to remove the component from the substrate. Notched end portions of inwardly projecting walls on the nozzle provide accurate registration with upper edges of the component, and permit accurate spacing of a skirt portion of the device relatively evenly from the substrate and relatively evenly from the sidewalls of the component.

REFERENCES:
patent: 3676911 (1972-07-01), Austin
patent: 3912153 (1975-10-01), Hartleroad et al.
patent: 4564135 (1986-01-01), Barresi et al.
patent: 4610388 (1986-09-01), Koltuniak et al.
patent: 4634043 (1987-01-01), Avedissian
patent: 4659004 (1987-04-01), Fridman
IBM Technical Disclosure Bulletin, "Solder Reflow Tool", C. Trollman, vol. 11, No. 10, Mar. 1969.

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