Nozzle structure for air flow soldering/desoldering

Details Nozzle structure for air flow soldering/desoldering Nozzle structure for air flow soldering/desoldering

1985-08-08

1986-12-02

Camby, John J.

Heating

Heat applicator having structure for mounting it on or...

53440, 219273, 228 20, 432231, F24J 300, B23K 100

Patent

active

046262059

ABSTRACT:
Nozzle structure suitable for bringing heated fluid into contact with a plurality of terminals of a modular electronic component to facilitate attachment of the component to a substrate or removal therefrom. The nozzle structure comprises a conduit forming member engageable with the component and with the substrate to form a heated fluid conduit extending around the periphery of the component, and a heated fluid delivery conduit coupled to the conduit forming member for delivering heated fluid to the heated fluid conduit to effect melting of solder or the like at the terminals of the component.

REFERENCES:
patent: 3524247 (1970-08-01), Goldschmied
patent: 4366925 (1983-01-01), Fanene
patent: 4436242 (1984-03-01), Shisler et al.
patent: 4444559 (1984-04-01), Schink et al.
patent: 4552300 (1985-11-01), Zovko

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