Nozzle for fast plating with plating solution jetting and suctio

Chemistry: electrical and wave energy – Apparatus – Electrolytic

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Details

204275, 204279, 205133, 205148, 239104, C25D 1700

Patent

active

058303340

ABSTRACT:
A nozzle for fast plating with plating solution jetting and sucking functions includes an outer cylindrical member and an inner cylindrical member, a plating solution issuing passage being defined between the outer and inner cylindrical members, and the inner space in the inner cylindrical member constituting a plating solution sucking passage. The inner cylindrical member has a front end flared portion having a forwardly flared surface acting to diffuse the solution. The outer cylindrical member has a front open end defining a gap with respect to the flared surface, the gap constituting a jetting port of the plating solution jetting passage. Plating solution supplied from a supply opening of the plating solution jetting passage is jetted from the jetting port toward a workpiece to be plated, the jetted plating solution is discharged from a rear end discharge opening of the plating solution sucking passage.

REFERENCES:
patent: 4287029 (1981-09-01), Shimamurd
patent: 4376683 (1983-03-01), Hellwig et al.
patent: 4818348 (1989-04-01), Smith
patent: 5372700 (1994-12-01), Pilorge et al.
patent: 5382343 (1995-01-01), Zwerner
patent: 5397453 (1995-03-01), Imori

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