Metal fusion bonding – With means to handle work or product – Work portion comprises electrical component
Reexamination Certificate
2001-12-03
2003-09-23
Elve, M. Alexandra (Department: 1725)
Metal fusion bonding
With means to handle work or product
Work portion comprises electrical component
C228S020100, C228S191000
Reexamination Certificate
active
06622902
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a nozzle apparatus for a surface mount device, and in particular to a nozzle apparatus for a surface mount device which can improve a blow performance releasing a parts picked up from a parts feeding apparatus of the surface mount device from a nozzle in order to place the parts on a printed circuit board.
2. Description of the Background Art
A surface mount device is used to rapidly precisely mount a plurality of parts on a printed circuit board. A structure of the surface mount device for rapidly and precisely mounting parts on the printed circuit board will now be explained with reference to the accompanying drawings.
FIG. 1
is a plan view illustrating the surface mount device. As shown therein, the surface mount device
10
includes an X-Y gantry
11
, a printed circuit board conveyor
12
, a module head
13
, a nozzle exchanging apparatus
14
and a parts feeding apparatus
15
.
The printed circuit board conveyor
12
transfers a printed circuit board
1
to a mounting operation position A. The X-Y gantry
11
is moved in an X-Y axis direction to vary a position of the module head
13
. The module head
13
picks up a parts from the parts feeding apparatus
15
by using the X-Y gantry
11
as a movement axis, transfers the parts to the printed circuit board
1
in the mounting operation position A, and places the parts on the printed circuit board
1
.
The module head
13
includes a plurality of nozzle devices
20
. A structure of the nozzle apparatus
20
will now be explained with reference to FIG.
2
. Referring to
FIG. 2
, the nozzle apparatus
20
includes a socket unit
21
and a holder unit
22
. The socket unit
21
includes a hollow shaft
21
a
, an assembly block
21
b
, a connection block
21
c
, a socket shaft
21
d
and an elastic member
21
e
. The holder unit
22
includes a holder
22
a
and a holder shaft
22
b.
The hollow shaft
21
a
of the socket unit
21
has a hollow, and the connection block
21
c
is installed by the assembly block
21
b
on the bottom surface of the hollow shaft
21
a
. The holder
22
a
of the holder unit
22
is provided in the connection block
21
c
. The socket shaft
21
d
and the elastic member
21
e
are disposed at the bottom surface of the connection block
21
c
to firmly and removably support the holder
22
a.
The socket shaft
21
d
mounted to the connection block
21
c
is supported at both side portions of the connection block
21
c
by the elastic member
21
e
. When the holder
22
a
of the holder unit
22
is installed to the socket unit
21
, the socket shaft
21
d
supports both side portions of the holder
22
a
. The holder shaft
22
b
is formed on the bottom surface of the holder
22
a
. When the holder
22
a
is positioned in the connection block
21
c
, a nozzle (not shown) is inserted and mounted on the holder shaft
22
b.
The nozzle picks up the parts from the parts feeding apparatus
15
, transfers the parts to the printed circuit board in the operation position, and places the parts on the printed circuit board. When the parts is placed on the printed circuit board, if a blow pressure releasing the parts from the nozzle does not reach into a wanted pressure for a short time (namely, vacuum non-break state), the parts to be mounted is sucked again to the nozzle. In order solve the foregoing problem, a parts blow performance should be improved to precisely and stably mount the parts.
SUMMARY OF THE INVENTION
Accordingly, it is a primary object of the present invention to provide a nozzle apparatus for a surface mount device which can improve a blow performance to precisely and stably release a parts from a nozzle when the nozzle picks up the parts and places the parts on a printed circuit board, by adding a nozzle elastic member and a moving member to the nozzle.
Another object of the present invention is to provide a nozzle apparatus for a surface mount device which can prevent problems such as an operation time delay when a parts sucked by a nozzle is not released from the nozzle, by improving a parts blow performance of the nozzle.
In order to achieve the above-described object of the invention, there is provided a nozzle device of a surface mounting device including a holder mounted and adhered closely to socket shafts by an elastic force of elastic members connected to both ends of the socket shafts, and a holder shaft formed on the bottom surface of the holder, the nozzle device of a surface mounting device comprising: a nozzle having a moving member assembled to the inside of the holder shaft, and moved in an upward or downward direction due to a pressure of air flown through the holder shaft, for picking up or placing a parts.
REFERENCES:
patent: 4500032 (1985-02-01), Ackerman
patent: 4552300 (1985-11-01), Zovko et al.
patent: 5285946 (1994-02-01), Tomigashi et al.
patent: 5673844 (1997-10-01), Sargent
Elve M. Alexandra
Fleshner & Kim LLP
McHenry Kevin
Mirae Corporation
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