Cleaning and liquid contact with solids – Processes – Hollow work – internal surface treatment
Patent
1997-01-30
1998-07-14
Stinson, Frankie L.
Cleaning and liquid contact with solids
Processes
Hollow work, internal surface treatment
134 254, 134148, 134153, 134198, 134402, 239550, B08B 302
Patent
active
057798168
ABSTRACT:
The present invention provides a system for wet processing a wafer which includes a processing chamber, in which the wafer is processed, and a means for supporting and rotating the wafer about an upright axis within the processing chamber. A nozzle through which a flow of fluid is directed onto the wafer is positioned downwardly over the wafer. The nozzle includes a nozzle housing in communication with a fluid supply and at least two tubes forming angled extensions from the nozzle housing. Each tube has an inner end and an outer end and directs a fluid flow from the inner end through the outer end to a predetermined location on the wafer while the wafer is rotated within the processing chamber. The inner end of each tube has an angled opening larger than the diameter of the inner end of each tube and the diameter of the outer end of each the tube is larger than the diameter of the inner end which reduces the fluid pressure and increases the fluid flow rate. The outer end of each tube also has an angled opening larger than the diameter of the outer end of each tube which contributes to a substantially constant fluid flow onto the wafer. In a preferred embodiment, the nozzle includes two tubes. A first tube directs a first fluid flow to a center area of the wafer and a second tube directs a second fluid flow to an area of the wafer substantially one-third the diameter of the wafer. The rotation of the wafer will cause the fluid to overflow toward the outer edge of the wafer, to thoroughly clean the wafer.
REFERENCES:
patent: 3041225 (1962-06-01), Emeis
patent: 3990462 (1976-11-01), Elftmann et al.
patent: 4557785 (1985-12-01), Ohkuma
patent: 4564280 (1986-01-01), Fukuda
patent: 4688918 (1987-08-01), Suzuki et al.
patent: 4771948 (1988-09-01), Furukawa et al.
patent: 4795497 (1989-01-01), McConnell et al.
European Patent Application (EPO) 509,097 , Oct. 1992.
Braquet Tsirigotis M. Kathryn
Stinson Frankie L.
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