Novolac type epoxy resin and electronic parts encapsulating resi

Details Novolac type epoxy resin and electronic parts encapsulating resi Novolac type epoxy resin and electronic parts encapsulating resi

1995-07-24

1997-06-24

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525485, 525507, 525523, 525534, 528110, C08F28300, C08G 5940

Patent

active

056418396

ABSTRACT:
This invention relates to a semiconductor encapsulating novolac type epoxy resin with the reduced stress, which is obtained by an addition reaction 1 to 15% of a novolac type epoxy resin of the following formula with a monohydric or dihydric aliphatic alcohol: ##STR1## (wherein R.sub.1 is hydrogen, halogen, alkyl, or aryl; R.sub.2 is selected from the group consisting of hydrogen, alkyl, aryl, or aryl having a substituent which may be glycidylether; and n is an integer not less than 0.)

REFERENCES:
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patent: 4707535 (1987-11-01), Koleske
patent: 4783509 (1988-11-01), Cavitt et al.
patent: 4981754 (1991-01-01), Hsu
patent: 5019639 (1991-05-01), Hofer et al.
patent: 5334674 (1994-08-01), Naka et al.
patent: 5342903 (1994-08-01), Wolleb et al.

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