Novel thermosetting resins and process for preparing the same

Chemistry of carbon compounds – Miscellaneous organic carbon compounds

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260 54, 260 55, 260 56, 260 59R, 260 67H, C08G 828, C08G 1004

Patent

active

040555461

ABSTRACT:
A novel thermosetting resin, the thermoset resin obtained therefrom having such a thermal resistance that the temperature at which the thermoset resin is caused to show a weight loss of 6% by heating at a temperature elevation rate of 10.degree. C. per minute is at least 400.degree. C., is prepared by reacting a specific phenolic resin with a member selected from the group consisting of a silicic acid ester of the formula Si(OR).sub.4 wherein R represents alkyl or aryl and a mixture of a silicic acid ester of the formula as defined above and a titanic acid ester of the formula Ti(OR).sub.4 wherein R has the same meaning as defined above in the presence of an alkaline catalyst while keeping the reaction system in a molten state, to an extent that 20- 70 mole %, based on the phenol present in the starting system to be reacted with said member, of phenolic hydroxyl groups in terms of the amount of phenol, remain unreacted. The thus obtained novel resins of the present invention can be easily set or hardened in accordance with the ordinary manner; namely by mixing with a thermohardening agent such as hexamethylenetetramine and then heating, to give thermoset resins having a superior thermal resistance as compared with the conventional phenolic resins. In addition, the thermoset resins obtained from the novel resins of this invention are excellent in mechanical strength, electrical properties and luster of molded articles.

REFERENCES:
patent: 2555489 (1951-06-01), Hirsch
patent: 2645630 (1953-07-01), Speier
patent: 2711417 (1955-06-01), Frisch
patent: 3081269 (1963-03-01), Shannon et al.
patent: 3755269 (1956-07-01), Moorhead
patent: 3847860 (1974-11-01), Seiler et al.

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