Novel thermosetting compositions and molding method

Details Novel thermosetting compositions and molding method Novel thermosetting compositions and molding method

1988-12-28

1989-11-14

Kight, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

C08G 804, C08G 1402

Patent

active

048808938

ABSTRACT:
A thermosetting resin containing composition can be heated to reduce its viscosity and used as a liquid in a liquid injection molding method. It has a phenolic resin content of about 80% to about 90% solids by weight, and contains about 5% to about 40% of a polyglycol. The composition may also contain resorcinol as a compatibilizing agent and a polyalkylene gylcol as the polyglycol agent. In a novel method the resin containing composition is heated to reduce its viscosity and introduced into a heated mold in a liquid injection molding method.

REFERENCES:
patent: 3878021 (1974-04-01), Tiedeman
patent: 4403066 (1983-09-01), Brode et al.
patent: 4578448 (1986-03-01), Brade et al.
patent: 4591612 (1986-05-01), Quinn

Affiliated with

Also associated with

Rating

Novel thermosetting compositions and molding method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Novel thermosetting compositions and molding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Novel thermosetting compositions and molding method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1853684