Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1980-03-03
1982-01-26
Smith, John D.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
29843, 29846, 228180R, 427190, 427191, 427199, 427216, 427226, 427229, 4273763, 4273767, 4273766, 4273835, H05K 312
Patent
active
043128963
ABSTRACT:
A novel process for fastening ceramic material such as alumina or the like to metallic material such as an electrical conductor. The process is characterized by the fact that a solder wettable, oxidation-resistant barrier is used, on metal particles printed onto the ceramic. In some advantageous processes, the carbide layer allows metallizing processes to be carried out in non-hydrogen atmospheres. The process requires no expensive noble metal; and it utilizes a barrier material which is sufficiently stable to tolerate conductive film formation at high temperatures. Nickel-carbide coated nickel is a particularly favorable material for use in the invention because it is conductive, in the ohmic sense, and is readily wetted by common solders.
Also disclosed are novel articles and compositions useful in practice of the process of the invention, and novel articles produced by the process of the invention.
REFERENCES:
patent: 3943168 (1976-03-01), Patterson
patent: 4079156 (1978-03-01), Youtsey et al.
patent: 4084314 (1978-04-01), Chakrabarty
patent: 4092459 (1978-05-01), Deffeyes et al.
patent: 4130854 (1978-12-01), Hertz
Cesari Robert A.
Graham Magnetics Inc.
Kehoe Andrew F.
McKenna John F.
Smith John D.
LandOfFree
Novel soldering process comprising coating a dielectric substrat does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Novel soldering process comprising coating a dielectric substrat, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Novel soldering process comprising coating a dielectric substrat will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1666902