Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent
1975-02-26
1977-01-04
Sebastian, Leland A.
Compositions
Electrically conductive or emissive compositions
Free metal containing
252518, 106 1, 428434, H01B 102
Patent
active
040011461
ABSTRACT:
Compositions useful for making electrical conductor patterns on a nonconductive substrate, the compositions comprising metal powder and 1-5% glass-free inorganic binder. The binder consists essentially of certain amounts of bismuth oxide and oxides of copper and/or lead, and optionally MnB.sub.2 and/or MnO.sub.2. The metal powder is either silver or a mixture of silver with a second metal powder; the second metal powder is Pt, Pd, Au, or an alloy of Cu with one or more of Pt, Pd, Au, and Ag. The weight ratio of Ag to other metals is at least 17/1. These compositions are useful for making conductor patterns on substrates, which patterns have good adhesion to the substrate, both initially and after thermal aging (e.g., 150.degree. C. for 48 hours).
REFERENCES:
patent: 2819170 (1958-01-01), Short
patent: 3293501 (1966-12-01), Martin
patent: 3763409 (1973-10-01), Sheard
patent: 3776769 (1973-12-01), Buck et al.
patent: 3799890 (1974-03-01), Smith
patent: 3799891 (1974-03-01), Smith
American Ceramic Society Bulletin 46, 789 (1967), "An Air Fired Gold-Copper Oxide Paste".
E. I. Du Pont de Nemours and Company
Parr E. Suzanne
Sebastian Leland A.
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