Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1974-01-02
1976-06-08
Newsome, John H.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
219121P, 427423, B50
Patent
active
039624862
ABSTRACT:
A novel process for applying cured thermoset resinous coatings to various kinds of substrates and in particular, to thin metal substrates, is disclosed. Finely divided thermosettable resinous particles containing a solid catalyst are introduced into a region of a plasma arc generated flame having a temperature greater than the melting point of said resin. The residence time of said resinous particles in the vicinity of said flame is maintained for a period sufficient to liquify substantially said particles and to initiate polymerization of the thermosettable resin particles. The liquified resin particles are propelled towards a substrate with sufficient velocity to cause said liquified resinous particles to impact with sufficient force to cause said particles to flow upon said substrate to coat same with a continuous, thin coating. The coated substrate is then cooled at a rate sufficiently slow to permit said coating to cure. The plasma flame must be located sufficiently near the substrate so that the resinous particles possess sufficient thermal and kinetic energy to flow into a thin coating retaining sufficient energy therein to continue curing to a thermoset state without addition of energy. The kinetic energy of the particle facilitates formation of a thin, uniform coating and creates additional thermal energy upon impact with said substrate.
REFERENCES:
patent: 3179784 (1965-04-01), Johnson
patent: 3183337 (1965-05-01), Winzeler et al.
patent: 3378391 (1968-04-01), Winzeler et al.
Coucher Robert G.
Gerek Gene
EPPCO
Newsome John H.
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