Novel method of electrodeposition coating

Details Novel method of electrodeposition coating Novel method of electrodeposition coating

1990-03-19

1991-08-13

Niebling, John F.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

2041816, 523425, C25D 1300

Patent

active

050393855

ABSTRACT:
A method of electrodeposition coating which permits low-temperature curing and comprises electrodepositing a water-base electrodeposition coating composition comprising an ionic group-containing resin and a crosslinking agent as vehicles on an article to be coated and then heating the coated article to form a cured coated film, wherein the ionic group-containing resin contains a hydroxyl group and the crosslinking agent contains at least two alkoxysilane groups and optionally hydroxysilane groups per molecule, and said resin can be cured by condensation reaction between said functional groups and the hydroxyl groups.

REFERENCES:
patent: 3868342 (1975-02-01), Magne
patent: 4046729 (1977-09-01), Scriven
patent: 4147679 (1979-04-01), Saiver
patent: 4330446 (1982-05-01), Miyosawa
Database WPIL, No. 75-09711, Derwent Publication Ltd., London, GB; & JP-A-49 057 033 (Toa Gosei Chem. Ind. Co.) 03-06-1974 *Abstract*.
Derwent Accession No. 89-131347, Derwent Publications Ltd., London Abstract of Japanese No. A-59-067379.
Derwent Accession No. 79-30328B, Derwent Publications Ltd., London Abstract of Japanese No. A-54-031279.
Derwent Accession No. 86-255277, Derwent Publications Ltd., London Abstract of Japanese No. A-61-182940.

Affiliated with

Also associated with

Rating

Novel method of electrodeposition coating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Novel method of electrodeposition coating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Novel method of electrodeposition coating will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1525522