Novel method and apparatus for hermetic encapsulation for integr

Details Novel method and apparatus for hermetic encapsulation for integr Novel method and apparatus for hermetic encapsulation for integr

1976-11-01

1978-07-18

Larson, Lowell A.

Metal working

Method of mechanical manufacture

Electrical device making

29588, H05K 328

Patent

active

041006755

ABSTRACT:
The base assembly of a dual in-line encapsulation package (DIP) is provided with a mounting surface such that the upper ends of the package pins are flat and are flush with the flat upper surface of the base enabling one-stage bonding of the integrated circuit chip to the inner leads of a lead frame and subsequently for one-stage bonding of the outer leads of the lead frame to the in-line pins of the encapsulation package.
The configuration of the package lid and the hermetic sealing of the lid to the base yields a package having a double protection seal arrangement in which each pin seal is isolated from the encapsulated chip.

REFERENCES:
patent: 3195026 (1965-07-01), Wegner et al.
patent: 3276854 (1966-10-01), Felker et al.
patent: 3436451 (1969-04-01), Wasser
patent: 3698073 (1972-10-01), Helda
patent: 3780429 (1973-12-01), Friebel et al.
patent: 3988825 (1976-11-01), Fuchs et al.

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