Novel hybrid packaging scheme for high density component circuit

Details Novel hybrid packaging scheme for high density component circuit Novel hybrid packaging scheme for high density component circuit

1977-10-26

1980-06-17

Smith, Jr., David

Electricity: electrical systems and devices

Miscellaneous

174 52FP, 361402, H05K 500

Patent

active

042086981

ABSTRACT:
A hybrid solid state package in which integrated circuits, precision resistor networks, capacitors and their interconnections are accommodated on a multi-layer process substrate while thick film resistors and interconnections provided on a separate substrate, which sub-assemblies are then sandwiched together using film epoxies are inserted within a single package, to thereby yield a structure of significantly smaller size and lighter weight and having minimal number of input-output interconnections as compared with conventional designs and without impairing quality or reliability.

REFERENCES:
patent: 3102213 (1963-08-01), Bedson et al.
patent: 3289045 (1966-11-01), Pritikin et al.
patent: 3404215 (1968-10-01), Burks et al.
patent: 3768157 (1973-10-01), Buie
patent: 4012579 (1977-03-01), Fox et al.

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