Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1975-04-09
1976-12-21
Tupman, W.
Metal working
Method of mechanical manufacture
Assembling or joining
29580, 29591, 357 69, B01J 1700
Patent
active
039979636
ABSTRACT:
A beam-lead integrated circuit chip structure which comprises a semiconductor chip substrate having a passivated planar surface from which active and passive devices in the circuit extend into the substrate. A plurality of peripheral beam-leads interconnected with the chip devices extend beyond the periphery of the chip and a plurality of solder mounds having a lower melting point than said beam-leads extends from the surface of the chip to a point beyond the plane of the beam-leads.
This chip structure permits a method of automatic alignment of said plurality of beam-leads with a corresponding plurality of beam-leads on a dielectric substrate which involves placing the chip on the substrate so that said plurality of solder mounds are respectively in registration with a plurality of corresponding solder-wettable land pads on said non-wettable dielectric substrate. The structure is then heated to melt the solder mounds, wetting said land pads and thereby moving the chip so as to bring said beam-leads into registration with a plurality of corresponding land leads.
REFERENCES:
patent: 3590478 (1971-07-01), Takehana
patent: 3878554 (1975-04-01), Mikome
patent: 3925880 (1975-12-01), Rosvold
IBM Technical Disclosure Bulletin, Castrucci, vol. 9, No. 12, May, 1967, p. 1805.
IBM Corporation
Kraft J. B.
Tupman W.
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