Notched trailing shield for perpendicular write head

Details Notched trailing shield for perpendicular write head Notched trailing shield for perpendicular write head

2007-11-20

2007-11-20

Kim, Paul D (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S603130, C029S603150, C029S603180, C216S022000, C216S039000, C216S041000, C360S121000, C360S122000, C360S125330, C360S317000, C451S005000, C451S041000

Reexamination Certificate

active

10853805

ABSTRACT:
During fabrication of a perpendicular write head in a wafer, at least two sides of a write pole are defined (e.g. by ion milling) while a third side of the write pole is protected by a masking material. At this stage, a material that is to be located in the write gap is already present between the write pole and the masking material. After definition of the write pole surfaces, a layer of dielectric material is deposited. During this deposition, the masking material is still present. Thereafter, the masking material (and any dielectric material thereon) is removed, to form a hole in the dielectric material. Next, a trailing shield is formed in the structure, so that at least one portion of the trailing shield is located in the hole, and another portion of the trailing shield is located over the dielectric material, in an area adjacent to the hole. Note that the gap material is now sandwiched between the portion of the trailing shield in the hole, and the write pole.

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