Notch beveling on semiconductor wafer edges

Details Notch beveling on semiconductor wafer edges Notch beveling on semiconductor wafer edges

1992-12-23

1994-03-01

Lavinder, Jack

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51326, 51104, 51105R, 51 3, B24B 908

Patent

active

052896617

ABSTRACT:
An apparatus and method of contouring the edge of a semiconductor wafer in a fiduciary mark notch utilizes a contouring wheel or burr having a smaller diameter than the diameter of the fiduciary mark notch.

REFERENCES:
patent: 1220287 (1917-03-01), Parsons
patent: 4344260 (1982-08-01), Ogiwara
patent: 4753049 (1988-06-01), Mori
patent: 4905425 (1990-03-01), Sekigawa
patent: 5036624 (1991-08-01), Steere, Jr.

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