Normal-flow heat exchanger

Details Normal-flow heat exchanger Normal-flow heat exchanger

2007-11-12

2010-11-23

Ciric, Ljiljana (Lil) V (Department: 3744)

Heat exchange

Flow passages for two confined fluids

Interdigitated plural first and plural second fluid passages

C165S165000, C165S167000, C165S173000, C165S174000, C165S175000

Reexamination Certificate

active

07836943

ABSTRACT:
A heat exchanger includes a heat transfer surface to transfer heat to or from a working fluid, a manifold region with a plurality of internal walls defining a plurality of inlet and outlet passages, and a heat transfer region disposed between the manifold region and the heat transfer surface.The internal walls are substantially normal to the heat transfer surface for directing working fluid in a normal direction, and include a plurality of alternating inflow and outflow portions in fluid communication with corresponding inlet passages and outlet passages. Adjacent inflow and outflow portions are in fluid communication with each other.A heat transfer structure is disposed in each of the plurality of inflow portions and extend between the internal walls of the inflow portion, the heat transfer structure being in thermal communication with the heat transfer surface to transfer heat between the working fluid and the heat transfer surface.

REFERENCES:
patent: 3361195 (1968-01-01), Meyerhoff et al.
patent: 4265302 (1981-05-01), Forster et al.
patent: 4450472 (1984-05-01), Tuckerman et al.
patent: 4494171 (1985-01-01), Bland et al.
patent: 4516632 (1985-05-01), Swift et al.
patent: 4880055 (1989-11-01), Niggemann et al.
patent: 5005640 (1991-04-01), Lapinski et al.
patent: 5016707 (1991-05-01), Nguyen
patent: 5029638 (1991-07-01), Valenzuela
patent: 5088005 (1992-02-01), Ciaccio
patent: 5099311 (1992-03-01), Bonde et al.
patent: 5145001 (1992-09-01), Valenzuela
patent: 5269372 (1993-12-01), Chu et al.
patent: 5309319 (1994-05-01), Messina
patent: 5429183 (1995-07-01), Hisamori et al.
patent: 5727618 (1998-03-01), Mundinger et al.
patent: 5835345 (1998-11-01), Staskus et al.
patent: 5836383 (1998-11-01), Zwittig
patent: 5843385 (1998-12-01), Dugan
patent: 5927396 (1999-07-01), Damsohn et al.
patent: 6005772 (1999-12-01), Terao et al.
patent: 6167952 (2001-01-01), Downing
patent: 6766817 (2004-07-01), da Silva et al.
patent: 6935411 (2005-08-01), Valenzuela
patent: 7278474 (2007-10-01), Valenzuela et al.
patent: 7302998 (2007-12-01), Valenzuela
Valenzuela, Javier A., Pending U.S. Appl. No. 11/214,497 entitled “Normal Flow Heat Exchanger,” filed Aug. 30, 2005.
L.S. Stephens, K.W. Kelly, D. Kountouris & J. McLean, “A Pin Fin Microheat Sink for Cooling Macroscale Conformal Surfaces Under the Influence of Thrust and Friction Forces,” Journal of Microelectromechanical Systems, vol. 10, No. 2, Jun. 2001, pp. 222-231.
Valenzuela, Javier A., Jasinski, Thomas J. Ph.D., Cooling High Heat Flux Devices with Mikros Microchannel Heat Sinks,: Mikros Manufacturing, Inc., Aug. 2003.
Y. Murakami & B.B. Mikic, “Parametric Optimization of Multichanneled Heat Sinks for VLSI Chip Cooling,” IEEE Transactions on Components and Packaging Technologies, vol. 24, No. 1, Mar. 2001, pp. 2-9.
L. Jiang, M. Wong & Y. Zohar, “Forced Convection Boiling in a Microchannel Heat Sink,” Journal of Microelectromechanical Systems, vol. 10, No. 1, Mar. 2001, pp. 80-87.
J. Darabi, M.M. Ohadi & D. deVoe, “An Electrohydrodynamic Polarization Micropump for Electronic Cooling,” Journal of Microelectromechanical Systems, vol. 10, No. 1, Mar. 2001, pp. 98-106.
C. Perret, J. Boussey, C. Schaeffer & M. Coyaud, “Analytic Modeling, Optimizing, and Realization of Cooling Devices in Silicon Technology,” IEEE Transactions on Components and Packaging Technologies, vol. 23, No. 4, Dec. 2000, pp. 665-672.
D. Copeland, “Manifold Microchannel Heat Sinks: Analysis and Optimization,” ASME/JSME Thermal Engineering Conference: vol. 4, 1995, pp. 169-174.
D. Copeland, H. Takahira, W. Nakayama & B. Pak, “Manifold Microchannel Heat Sinks: Theory and Experiment,” Advances in Electronic Packing, EEP-vol. 10-2, 1995, pp. 829-835.
A. Weisberg, H.H. Bau & J.N. Zemel, “Analysis of Microchannels for Integrated Cooling,” Int. J. Heat Mass Transfer, 1992, vol. 35, No. 10, pp. 2465-2474.
D.B. Tuckerman & R.F.W. Pease, “High-Performance Heat Sinking for VLSI,” IEEE Electron Device Letters, May 1981, vol. EDL-2, No. 5, pp. 126-129.

Affiliated with

Also associated with

Rating

Normal-flow heat exchanger does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Normal-flow heat exchanger, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Normal-flow heat exchanger will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4242821