Normal-flow heat exchanger

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

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C165S168000, C361S699000

Reexamination Certificate

active

06935411

ABSTRACT:
A heat exchanger (120) comprising a core (130) containing inlet manifolds (140), outlet manifold (126) and interconnecting channels (144) and having a heat-transfer surface (128). Each interconnecting channel fluidly communicates at one end with a corresponding inlet manifold and at the other end with the two outlet manifolds located immediately adjacent that inlet manifold. The inlet manifolds are located distal from the heat-transfer surface. The interconnecting channels are configured such that substantially all of the heat collected by a working fluid is collected as the working fluid flows from the inlet manifolds toward the heat-transfer surface in a direction substantially perpendicular to the heat-transfer surface.

REFERENCES:
patent: 3361195 (1968-01-01), Meyerhoff et al.
patent: 4265302 (1981-05-01), Forster et al.
patent: 4450472 (1984-05-01), Tuckerman et al.
patent: 4494171 (1985-01-01), Bland et al.
patent: 4516632 (1985-05-01), Swift et al.
patent: 4880055 (1989-11-01), Niggemann et al.
patent: 5005640 (1991-04-01), Lapinski et al.
patent: 5016707 (1991-05-01), Nguyen
patent: 5029638 (1991-07-01), Valenzuela
patent: 5088005 (1992-02-01), Ciaccio
patent: 5099311 (1992-03-01), Bonde et al.
patent: 5145001 (1992-09-01), Valenzuela
patent: 5269372 (1993-12-01), Chu et al.
patent: 5309319 (1994-05-01), Messina
patent: 5429183 (1995-07-01), Hisamori et al.
patent: 5727618 (1998-03-01), Mundinger et al.
patent: 5835345 (1998-11-01), Staskus et al.
patent: 5836383 (1998-11-01), Zwittig
patent: 5843385 (1998-12-01), Dugan
patent: 5927396 (1999-07-01), Damsohn et al.
patent: 6005772 (1999-12-01), Terao et al.
patent: 6167952 (2001-01-01), Downing
L.S. Stephens, K.W. Kelly, D. Kountouris & J. McLean, “A Pin Fin Microheat Sink for Cooling Macroscale Conformal Surfaces Under the Influence of Thrust and Frictional Forces”, Journal of Microelectromechanical Systems, vol. 10, No. 2, Jun. 2001, pp. 222-231.
Y. Murakami & B.B. Mikic, “Parametric Optimization of Multichanneled Heat Sinks for VLSI Chip Cooling”, IEEE Transactions on Components and Packaging Technologies, vol. 24, No. 1, Mar. 2001, pp. 2-9.
L. Jiang, M. Wong & Y. Zohar, “Forced Convection Boiling in a Microchannel Heat Sink”, Journal of Microelectromechanical Systems, vol. 10, No. 1, Mar. 2001, pp. 80-87.
J. Darbi, M.M. Ohadi & D. DeVoe, “An Electrohydrodynamic Polarization Micropump for Electronic Cooling”, Journal of Microelectromechanical Systems, vol. 10, No. 1, Mar. 2001, pp. 98-106.
C. Perret, J. Boussey, C. Schaeffer & M. Coyaud, “Analytic Modeling, Optimizing, and Realization of Cooling Devices in Silicon Technology”, IEEE Transactions on Components and Packaging Technologies, vol. 23, No. 4, Dec. 2000, pp. 665-672.
D. Copeland, “Manifold Microchannel Heat Sinks: Analysis and Optimization”, ASME/JSME Thermal Engineering Conference: vol. 4, 1995, pp. 169-174.
D. Copeland, H. Takahira, W. Nakayama & B. Pak, “Manifold Microchannel Heat Sinks: Theory and Experiment”, Advances in Electronic Packing, EEP-vol. 10-2, 1995, pp. 829-835.
A. Weisberg, H.H. Bau & J.N. Zemel, “Analysis of microchannels for integrated cooling”, Int. J. Heat Mass Transfer, 1992, vol. 35, No. 10, pp. 2465-2474.
D.B. Tuckerman & R.F.W. Pease, “High-Performance Heat Sinking for VLSI”, IEEE Electron Device Letters, May 1981, vol. EDL-2, No. 5, pp. 126-129.

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