Static information storage and retrieval – Floating gate – Particular connection
Reexamination Certificate
2002-04-04
2003-05-13
Mai, Son (Department: 2818)
Static information storage and retrieval
Floating gate
Particular connection
C365S185130
Reexamination Certificate
active
06563735
ABSTRACT:
BACKGROUND OF THE INVENTION
A. Field of the Invention
The present invention relates to a semiconductor memory device and, more particularly, to a NOR-structured semiconductor memory device with a novel configuration of bit line connection.
B. Description of the Related Art
FIG. 1
is a schematic diagram showing a conventional NOR-structured semiconductor memory device
1
. For the sake of descriptive simplicity, the conventional NOR-structured memory device
1
shown in
FIG. 1
includes a 2×8 memory cell array whose memory cells are electrically connected to corresponding word lines and bit lines. More specifically, the memory cells arranged in a row are electrically connected in parallel to a word line while the memory cells arranged in a column are electrically connected in parallel to two adjacent bit lines. For example, memory cells M
10
to M
17
are arranged in such a way that the gate electrodes of them are electrically connected in parallel to a word line WL
1
. Memory cells M
10
and M
00
are arranged in such a way that the channel electrodes (i.e., source and drain electrodes) of them are electrically connected in parallel to two adjacent bit lines BL
0
and BL
1
, respectively.
Referring to
FIG. 1
, bit lines BL
0
and BL
2
are coupled to a main bit line MBL
0
through bit line transistors BLT
0
and BLT
1
, respectively. Bit lines BL
1
and BL
3
are coupled to a main bit line MBL
2
through bit line transistors BLT
4
and BLT
5
, respectively. The bit line transistors BLT
0
, BLT
1
, BTL
4
, and BLT
5
may be N-type MOS (Metal-Oxide-Semiconductor) transistors and become conductive or non-conductive in response to selection signals input from selection lines SEL
0
, SEL
1
, SEL
2
, and SEL
3
, respectively. Similarly, bit lines BL
4
and BL
6
are coupled to a main bit line MBL
1
through bit line transistors BLT
2
and BLT
3
, respectively, while bit lines BL
5
and BL
7
are coupled to a main bit line MBL
3
through bit line transistors BLT
6
and BLT
7
, respectively. The bit line transistors BLT
2
, BLT
3
, BTL
6
, and BLT
7
may be N-type MOS transistors and become conductive or non-conductive in response to selection signals input from selection lines SEL
0
, SEL
1
, SEL
2
, and SEL
3
, respectively.
The memory cells M
00
to M
07
and M
10
to M
17
may be programmable memory devices such as EPROM (Erasable Programmable Read Only Memory) or Flash EEPROM. In this case, the programming operation of a selected memory cell in the conventional NOR-structured memory device is described as follows. To program the memory cell M
00
for example, the word line WL
0
is activated and the selection lines SEL
0
and SEL
2
are activated to turn on the bit line transistors BLT
0
and BLT
4
. In addition, the selection lines SEL
1
and SEL
3
are deactivated to turn off the bit line transistors BLT
1
and BLT
5
. At the same time, the main bit line MBL
2
is supplied with a high programming voltage and the main bit lines MBL
0
, MBL
1
, and MBL
3
are all grounded. Therefore, the memory cell M
00
is programmed through a current path L
1
consisting of the main bit line MBL
2
, the bit line transistor BLT
4
, the bit line BL
1
, the bit line BL
0
, and the bit line transistor BLT
0
, and the main bit line MBL
0
.
During the programming operation of the memory cell M
00
, however, the memory cells M
01
, M
02
, M
03
, and M
04
are simultaneously activated by the word line WL
1
and subject to programming disturbance by the high programming voltage from the main bit line MBL
2
since two other current paths L
2
and L
3
are formed as shown in FIG.
1
. Therefore, it is desirable to provide a NOR-structured semiconductor memory device capable of preventing the programming disturbance during the programming operation.
There is also a problem in the conventional NOR-structured semiconductor memory device during the data reading operation. To read the data stored in the memory cell M
00
for example, a sense current is supplied to the main bit line MBL
2
. If the memory cell M
00
is turned off at the activation of the word line WL
0
, the potential of the main bit line MBL
2
increases because no current path L
1
is formed. Subsequently, the potential of the main bit line MBL
2
is sensed and the data reading operation of the memory cell M
00
is finished. During the data reading operation of the memory cell M
00
, however, the above-mentioned leakage current paths L
2
and L
3
as a result of the simultaneous activation of the memory cells M
01
, M
02
, M
03
, and M
04
by the word line WL
0
cause that it takes a longer time to raise the potential of the main bit line MBL
2
. In other words, it is difficult for a conventional NOR-structured semiconductor device shown in
FIG. 1
to achieve high-speed data reading operations. In some cases, the leakage current paths L
2
and L
3
even make the sensed potential of the main bit line MBL
2
become such a low value that the memory cell M
00
is falsely determined as a turned-on cell. Therefore, it is desirable to provide a NOR-structured semiconductor memory device with high-speed data reading operations and correct data determinations.
SUMMARY OF THE INVENTION
In view of the above-mentioned problems of the conventional NOR-structured semiconductor memory device, it is an object of the present invention to provide a novel NOR-structured semiconductor memory device capable of preventing the programming disturbance during programming operations.
It is another object of the present invention to provide a novel NOR-structured semiconductor memory device with high-speed data reading operations.
It is still another object of the present invention to provide a novel NOR-structured semiconductor memory device in which the data stored in memory cells are correctly determined.
According to the present invention, a NOR-structured semiconductor memory device is provided with a semiconductor memory cell array having a plurality of semiconductor memory cells. The plurality of semiconductor memory cells may consist of programmable cells, such as EPROM or Flash EEPROM. A plurality of bit lines are electrically connected to the semiconductor memory cell array and divided into at least four bit line groups. At least two bit lines of each bit line group of the at least four bit line groups are coupled to a main bit line through at least two bit line transistors, respectively. The main bit line serves as a common main bit line for the coupled at least two bit lines. Furthermore, the bit lines of the NOR-structured semiconductor memory device are arranged in such a way that at least four adjacent bit lines thereof are selected from four different bit line groups and coupled to four different main bit lines, respectively.
During programming operations, two adjacent bit lines of the four adjacent bit lines are supplied with a programming voltage while the other two adjacent bit lines are grounded. Therefore, the NOR-structured semiconductor memory device according to the present invention successfully prevents the programming disturbance because no leakage current path is formed.
During data reading operations, two adjacent bit lines of the four adjacent bit lines are supplied with a sense current while the other two adjacent bit lines are grounded. Therefore, the NOR-structured semiconductor memory device according to the present invention correctly determines the data stored in memory cells at a high speed because no leakage current path is formed.
REFERENCES:
patent: 5726929 (1998-03-01), Suminaga et al.
patent: 5909405 (1999-06-01), Lee et al.
patent: 6088277 (2000-07-01), Kim et al.
patent: 6147912 (2000-11-01), Kitazawa
patent: 6496405 (2002-12-01), Hibino
Chen Gin-Liang
Chen Hsin-Chien
Ho Hsin-Yi
Hung Chun-Hsiung
Liou Ho-Chun
Macronix International Co. Ltd.
Mai Son
Martine & Penilla LLP
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