Nonvolatile semiconductor memory device and manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Charge transfer device

Reexamination Certificate

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C257S204000, C257S288000, C257S315000

Reexamination Certificate

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10860014

ABSTRACT:
A nonvolatile semiconductor memory device including at least one MOS transistor in a peripheral circuit comprises a semiconductor substrate, isolation insulating films for defining a plurality of element formation regions, each of the isolation insulating films being buried in an isolation trench provided in the semiconductor substrate, a floating gate provided in each of the element formation regions via a first gate insulating film, a control gate provided on the floating gate via a second gate insulating film, and source and drain regions provided in the semiconductor substrate in self-alignment with the control gate, wherein the floating gate is self-aligned at an isolation end in a direction of a channel width, and comprises a plurality of polysilicon films.

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F. Arai et al., “High-Density (4.4F2) NAND Flash Technology Using Super-Shallow Channel Profile (SSCP) Engineering,” IEDM Tech. Dig. (2000), pp. 775-778.

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